
DS12R885/DS12CR887/DS12R887
RTCs with Constant-Voltage Trickle Charger
22
Maxim Integrated
PACKAGE
THETA-JA (°C/W)
THETA-JC (°C/W)
SO
105
22
Thermal Information
Chip Information
TRANSISTOR COUNT: 17,061
PROCESS: CMOS
SUBSTRATE CONNECTED TO GROUND
VCC
CS
AD7
DS
A
1
2
3
4
BC
D
5
6
GND
AD6
EF
RESET VCC R/W
AD5
GND AD4
VCC
AS
AD3
N.C.
GND
AD2
IRQ
VCC SQW
AD1
GND AD0
VCC MOT
GND
RCLR
GND GND
VCC
GND
GND GND
7
VCC
VCC VCC
GND GND GND
8
VCC
VCC VCC
GND GND GND
48 BGA
DS12R887
TOP VIEW
(BUMP SIDE DOWN)
Pin Configurations (continued)
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
24 SO
W24+1
24 EDIP
MDP24+1
48 BGA
V48-H1
Package Information
For the latest package outline information and land patterns (foot-
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.